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Coaxlink Quad 3D-LLE

Quad CXP-6 图像采集卡,板载激光线抽提用于三维分析

特性一览
  • 激光线提取,零主机CPU占用
  • 支持单/双激光线提取生成深度图
  • 实时生成16位3D高度图
  • 算法选择:最大值、峰值、重心 (COG)
  • 精度︰ 高达 1/256 像素 (使用峰值和 COG 算法)
  • 性能:每秒 19,000 组数据 (profile),来自 1024 x 128 图像。每秒 38,000 组数据 (profile),来自 1024 x 64 图像。
  • Memento 事件日志工具



比较 购买地点


激光线提取,零主机CPU占用
激光线提取,零主机CPU占用

Coaxlink的板载FPGA在图像采集过程中测量激光线的位置,没有给主机CPU增加负荷。


Power over CoaXPress
Power over CoaXPress

  • Power over CoaXPress:在采用24伏直流电的情况下,相机每通道的功率达17 W,并提供设备自动检测、测量和过载保护。
  • 可以测量总电压和电流以及每个通道的电压和电流,从而进行验证和性能偏差监控。


使用标准同轴电缆
使用标准同轴电缆

  • 只需一条并不昂贵的电缆,就可完成数据传输、相机控制、触发器和电源供应
  • 顶级的可靠性和灵活性,可在恶劣环境执行


通用 I/O 线
通用 I/O 线

  • 兼容多种传感器和运动编码器。
  • 高速差分输入:正交运动编码器,支持高达 5 MHz。
  • 隔离式电流感应输入:接受 5V、12V、24V 信号电压,最高 50 kHZ,个别电气隔离高达 250VDC 和 170VAC RMS。
  • 隔离触式输出。
  • 高速 5V 兼容 TTL 输入/LVTTL 输出。


Windows、Linux和macOS驱动程序可用
Windows、Linux和macOS驱动程序可用

  • 支持英特尔64位平台以及ARM 64位平台


实时生成16位3D高度图
实时生成16位3D高度图

Coaxlink直接将计算的3D高度图实时传输到主机PC内存,无延迟。


双激光线提取
双激光线提取

在软硬件实现的支持之下,双激光线提取过程减轻了遮挡的影响。当对象的某些部分未被任何激光照到时,便会发生遮挡。使用两条具有不同角度的激光可以减少这些不确定的区域。运用 Easy3DLaserLine 中包含的基于对象的校准,可将采集的数据整合到单独一个校准过的点云中。


稳健的连接器,确保可靠连接
稳健的连接器,确保可靠连接

  • Coaxlink CXP-6 使用 DIN 1.0/2.3 连接器,带推/拉闩锁系统


高性能 DMA(直接存储器存取)
高性能 DMA(直接存储器存取)

  • 直接传输到用户分配的内存和显示 PCI 地址的硬件板
  • 硬件分散 - 聚集支持
  • 64 位寻址能力


兼容<a target="_blank" href="https://www.euresys.com/en/Products/Machine-Vision-Software/eGrabber"target="_blank">eGrabber
兼容eGrabber


在DG06技术开发部的支持下开发的
在DG06技术开发部的支持下开发的


连接最快速最高分辨率的相机来采集图像
连接最快速最高分辨率的相机来采集图像

  • 在同行业中最高的数据采集速率
  • 25 Gbit/s (2,500 MB/s) 带宽(从相机到主机 PC 内存)


长线缆支持
长线缆支持

  • CXP-6 速度时 40 米 (6.25 Gbps)
  • CXP-3 速度时 100 米 (3 Gbps)


Memento 事件日志工具

  • Memento是供Coaxlink和Grablink卡使用的高级开发和调试工具。
  • Memento 记录与相机、图像采集卡及其驱动程序以及应用程序相关的所有事件的准确日志。
  • 对于包含时间戳的时间,它为开发人员提供精确的时间表,也提供上下文信息和逻辑分析器视图。
  • 它可以在应用程序开发和调试,以及机器操作期间提供宝贵的协作。


区域扫描触发功能

  • 触发器用于在零件就位时启动采集。硬件触发器来自 Coaxlink 的 I/O 线。软件触发器来自于应用程序。
  • 可控的延时触发器,用来控制推迟图像采集的时间点。
  • 触发抽取功能允许跳过某些触发器。
  • 相机曝光控制允许应用来控制相机的曝光时间。
  • 当系统开始采集图像时,Coaxlink采集卡会在一个适当的时间点生成信号来控制连接在输出端的照明设备。


符合 Genicam 标准
符合 Genicam 标准

包括支持

  • GenApi
  • 标准功能命名约定(SFNC)
  • GenTL


Mechanical
Format Standard profile, half length, 4-lane PCI Express card
Cooling method Air cooling, fan-cooled heatsink
Mounting For insertion in a standard height, 4-lane or higher, PCI Express card slot
Connectors
  • 'A', 'B', 'C', 'D' on bracket:
    • 4x DIN 1.0/2.3 female connectors
    • CoaXPress host interface
  • 'EXTERNAL I/O' on bracket:
    • 26-pin 3-row high-density female sub-D connector
    • I/O lines and power output
  • 'INTERNAL I/O 1' and 'INTERNAL I/O 2' on PCB:
    • 2x 26-pin 2-row 0.1" pitch pin header with shrouding
    • I/O lines and power output
  • 'AUXILIARY POWER INPUT' on module:
    • 6-pin PEG power socket
    • 12 VDC power input for PoCXP camera(s) and I/O power
  • 'C2C-LINK' on module:
    • 6-pin 2-row 0.1-in header
    • Card to card link
LED indicators
  • 'A', 'B', 'C', 'D' on bracket:
    • Bi-color red/green LEDs
    • CoaXPress Host connector indicator
  • 'FPGA STATUS LAMP' on PCB:
    • Bi-color red/green LED
    • FPGA status indicator
  • 'BOARD STATUS LAMP' on PCB:
    • Bi-color red/green LED
    • Board status indicator
Switches 'RECOVERY' on PCB:
  • 3-pin 1-row 0.1" header or 2-way DIP switch
  • Firmware emergency recovery
Dimensions PCB L X H: 167.65 mm x 111.15 mm, 6.6 in x 4.38 in
Weight 180 g, 6.35 oz
Host bus
Standard PCI Express 2.0
Link width
  • 4 lanes
  • 1 lane or 2 lanes with reduced performance
Link speed
  • 5.0 GT/s (PCIe 2.0)
  • 2.5 GT/s (PCIe 1.0) with reduced performance
Maximum payload size 512 bytes
DMA 32- and 64-bit
Peak delivery bandwidth 2,000 MB/s
Effective (sustained) delivery bandwidth 1,700 MB/s (Host PC motherboard dependent)
Power consumption Typ. 16.8 W (3.8 W @ +3.3V, 13 W @ +12V), excluding camera and I/O power output
Camera / video inputs
Interface standard(s) CoaXPress 1.0, 1.1 and 1.1.1
Connectors Four DIN1.0/2.3 75 Ohms CXP-6
Status LEDs One CoaXPress Host connection status LED per connection
Number of cameras One 1- or 2- or 4-connection camera
Maximum aggregated camera data transfer rate 25 Gbit/s (2,500 MB/s)
Supported CXP down-connection speeds 1.25 GT/s (CXP-1), 2.5 GT/s (CXP-2), 3.125 GT/s (CXP-3), 5 GT/s (CXP-5), and 6.25 GT/s (CXP-6)
Number of CXP data streams (per camera) 1 data stream per camera
Maximum CXP stream packet size 16,384 bytes
PoCXP (Power over CoaXPress)
  • PoCXP Safe Power:
    • 17 W of 24V DC regulated power per CoaXPress connector
    • PoCXP Device detection and automatic power-on
    • Overload and short-circuit protections
  • On-board 12V to 24V DC/DC converter
  • A +12V power source must be connected to the AUXILIARY POWER INPUT connector using a 6-pin PEG cable
Camera types Grayscale area-scan cameras
Camera pixel formats supported Mono8
Area-scan camera control
Trigger
  • Precise control of asynchronous reset cameras, with exposure control.
  • Support of camera exposure/readout overlap.
  • Support of external hardware trigger, with optional delay and trigger decimation.
Strobe
  • Accurate control of the strobe position for strobed light sources.
  • Support of early and late strobe pulses.
On-board processing
On-board memory 1 GB
Image data stream processing Laser Line Extraction (LLE) processing core to compute the vertical position of one detected laser line along a ROI using one of the following algorithms:
  • Maximum Detection algorithm
    • Maximum ROI width: 8192 pixels
    • Maximum ROI height: 65536 pixels
    • Depth map format: 16-bit unsigned integer number
    • Accuracy: 1 pixel
  • 8-bit Maximum Detection algorithm
    • Maximum ROI width: 8192 pixels
    • Maximum ROI height: 256 pixels
    • Depth map format: 8-bit unsigned integer number
    • Accuracy: 1 pixel
  • Peak Detection algorithm
    • Maximum ROI width: 8192 pixels
    • Maximum ROI height: 2048 pixels
    • Depth map format: UQ11.5 fixed-point unsigned number
    • Accuracy: 1/32 pixel
  • High accuracy Peak Detection algorithm
    • Maximum ROI width: 8192 pixels
    • Maximum ROI height: 256 pixels
    • Depth map format: UQ8.8 fixed-point unsigned number
    • Accuracy: 1/256 pixel
  • Center Of Gravity algorithm
    • Maximum ROI width: 8192 pixels
    • Maximum ROI height: 2048 pixels
    • Depth map format: UQ11.5 fixed-point unsigned number
    • Accuracy: 1/32 pixel
  • High accuracy Center Of Gravity algorithm
    • Maximum ROI width: 8192 pixels
    • Maximum ROI height: 256 pixels
    • Depth map format: UQ8.8 fixed-point unsigned number
    • Accuracy: 1/256 pixel
Data stream statistics
  • Measurement of:
    • Frame rate (Area-scan only)
    • Line rate
    • Data rate
  • Configurable averaging interval
Event signaling and counting
  • The application software can be notified of the occurrence of various events:
    • Standard event: the EVENT_NEW_BUFFER event notifies the application of newly filled buffers
    • A large set of custom events
  • Custom events sources:
    • I/O Toolbox events
    • Camera and Illumination control events
    • CoaXPress data stream events
    • CoaXPress host interface events
  • Each custom event is associated with a 32-bit counter that counts the number of occurrences
  • The last three 32-bit context data words of the event context data can be configured with event-specific context data:
    • Event-specific data
    • State of all System I/O lines sampled at the event occurrence time
    • Value of any event counter
General Purpose Inputs and Outputs
Number of lines 20 I/O lines:
  • 4 differential inputs (DIN)
  • 4 singled-ended TTL inputs/outputs (TTLIO)
  • 8 isolated inputs (IIN)
  • 4 isolated outputs (IOUT)
Usage
  • Any I/O input lines can be used by any LIN tool of the I/O Toolbox
  • Selected pairs of I/O input lines can be used by any QDC tool of the I/O toolbox to decode A/B signals of a motion encoder
Electrical specifications
  • DIN: High-speed differential inputs, up to 5 MHz, compatible with ANSI/EIA/TIA-422/485 differential line drivers and complementary TTL drivers
  • TTLIO: High-speed 5V-compliant TTL inputs or LVTTL outputs, compatible with totem-pole LVTTL, TTL, 5V CMOS drivers or LVTTL, TTL, 3V CMOS receivers
  • IIN: Isolated current-sense inputs with wide voltage input range up to 30V, compatible with totem-pole LVTTL, TTL, 5V CMOS drivers, RS-422 differential line drivers, potential free contacts, solid-state relays and opto-couplers
  • IOUT: Isolated contact outputs compatible with 30V / 100mA loads
NOTE: IIN and IOUT lines provide a functional isolation grade for the circuit technical protection. It does not provide an isolation that can protect a human being from electrical shock!
Filter control
  • Glitch removal filter available on all System I/O input lines
  • Configurable filter time constants:
    • for DIN and TTLIO lines: 50 ns, 100 ns, 200 ns, 500 ns, 1 µs
    • for IIN lines: 500 ns, 1 µs, 2 µs, 5 µs, 10 µs
Polarity control Yes
Power output Non-isolated, +12V, 1A, with electronic fuse protection
I/O Toolbox tools The I/O Toolbox is a configurable interconnection of tools that generates events (usually triggers):
  • Line Input tool (LIN): edge detector delivering events on rising or falling edges of any selected input line.
  • Quadrature Decoder tool (QDC): a composite tool including:
    • A quadrature edge detector delivering events on selected transitions of selected pairs of input lines.
    • An optional backward motion compensator for clean line-scan image acquisition when the motion is unstable.
    • A 32-bit up/down counter for delivering a position value.
  • Device Link Trigger tool (DLT): delivers an event on reception of a valid high-speed CoaXPress 2.0 connection trigger packet message from the remote device.
  • User Actions Scheduler tool (UAS): to delegate the execution of 'User Actions' at a scheduled time or encoder position. Possible user actions include setting low/high/toggle any bit of the User Output Register or generation of any User Events.
  • Delay tool (DEL): to delay up to 16 events from one or two I/O toolbox event sources, by a programmable time or number of motion encoder ticks (any QDC events).
  • Divider tool (DIV): to generate an event every nth input events from any I/O toolbox event source.
  • Multiplier/divider tool (MDV): to generate m events every d input events from any I/O toolbox event source.
  • The 'Input Tools' (LIN, QDC, DLT and UAS) can be further processed by the 'Event Tools' (DEL, DIV and MDV) to generate any of the following "trigger" events:
    • The "cycle trigger" of the Camera and Illumination controller
    • The "cycle sequence trigger" of the Camera and Illumination controller
    • The "start-of-scan trigger" of the Acquisition Controller (line-scan only)
    • The "end-of-scan trigger" of the Acquisition Controller (line-scan only)
I/O Toolbox composition 8 LIN, 1 QDC, 1 UAS, 2 DEL, 1 DIV, 1 MDV, 2 C2C
C2C-Link
Description
  • Accurate synchronization of the trigger and the start-of-exposure of multiple grabber-controlled area-scan cameras.
  • Accurate synchronization of the start-of-cycle, start-of-scan and end-of-scan of multiple grabber-controlled line-scan cameras.
Specification
  • C2C-Link synchronizes cameras connected to:
    • the same card
    • to different cards in the same PC (requires an accessory cable such as the "3303 C2C-Link Ribbon Cable" or a custom-made C2C-Link cable)
    • to different cards in different PCs (requires one "1636 InterPC C2C-Link Adapter" for each PC and one RJ 45 CAT 5 STP straight LAN cable for each adapter but the last one)
  • Maximum distance:
    • 60 cm inside a PC
    • 1200 m cumulated adapter to adapter cable length
  • Maximum trigger rate:
    • 2.5 MHz for configurations using a single PC, or up to 10 PCs and 100 m total C2C-Link cable length
    • 200 kHz for configurations up to 32 PCs and 1200m total C2C-Link cable length
  • Trigger propagation delay from master to slave devices:
    • Less than 10 ns for cameras on the same card or on different cards in the same PC
    • Less than 265 ns for cameras on different cards in different PCs (3 PCs and 40m total C2C-Link cable length)
Software
Host PC Operating System
  • Microsoft Windows 11, 10, 8.1, 7 for x86-64 (64-bit) processor architecture
  • Linux for x86-64 (64-bit) and AArch64 (64-bit) processor architectures
  • macOS for x86-64 (64-bit) and AArch64 (64-bit) processor architectures
APIs
  • EGrabber class, with C++ and .NET APIs: .NET assembly designed to be used with development environments compatible with .NET frameworks version 4.0 or higher
  • GenICam GenTL producer libraries compatible with C/C++ compilers:
    • 'x86_64' dynamic library designed to be used with ISO-compliant C/C++ compilers for the development of x86-64 (64-bit) applications
    • 'aarch64' dynamic library designed to be used with ISO-compliant C/C++ compilers for the development of AArch64 (64-bit) applications
Environmental conditions
Operating ambient air temperature 0 to +55 °C / +32 to +131 °F
Operating ambient air humidity 10 to 90% RH non-condensing
Storage ambient air temperature -20 to +70 °C/ -4 to +158 °F
Storage ambient air humidity 10% to 90% RH non-condensing
Certifications
Electromagnetic - EMC standards
  • European Council EMC Directive 2014/30/EU
  • United States FCC rule 47 CFR 15
EMC - Emission
  • EN 55032:2015 / CISPR 32:2012 Class B
  • FCC 47 Part 15 Class B
EMC - Immunity
  • EN 55024:2010 / CISPR 24:2010
  • EN 61000-4-2:2009
  • EN 61000-4-3:2006
  • EN 61000-4-4:2004
  • EN 61000-4-6:2014
KC Certification Korean Radio Waves Act, Article 58-2, Clause 3
Flammability PCB compliant with UL 94 V-0
RoHS European Union Directive 2015/863 (ROHS3)
REACH European Union Regulation 1907/2006
WEEE Must be disposed of separately from normal household waste and must be recycled according to local regulations
Ordering Information
Product code - Description
Optional accessories
3D Acquisition Elec

用于电子检测机的3D图像采集

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Coaxlink Quad 3D-LLE
3D Acquisition Man

用于检测机的3D图像采集

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Coaxlink Quad 3D-LLE